Electronic Packaging Mechanical Analysis

Linear Mechanical analysis of electronic components can involve the assessment of thermal and vibration predictions.  Thermal analysis of components typically involve a simulation of the components, the PCB (printed circuit board), and and chassis for a specific environment to determine case and junction temperatures.  This ensures that the design will meet component temperatures for expected life.  We have experience in mitigating thermal issues with a number of technique if the design is insufficient.  Thermal analysis results can also be used for low cycle fatigue predictions of the mechanical joints including the solder and leadwires if applicable.  This fatigue is a result of the differential expansion between a component and PCB.  Sophisticated FEA simulations have included thermal cycling of the system which included solder material creep models to determine stress levels for faituge prediction.

Vibration analysis can also be completed of the assembly to determine high cycle fatigue life of the chassis and components.  Environments such as random, sinusiodal, or shock can be assessed to ensure that the mechanical attachements of the compnents will meet an expected design life.  The dynamic induced PCB deflections under vibration loading excercises the leadwires and solder joints and can be a dominant failure mode.  If these levels are high enough, we have experience in sizing isolator systems to reduce the impact on the components or chassis as necessary.