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                ANALYSIS

       ♦ Structural
       ♦ Fracture
       ♦ Dynamics
       ♦ Thermal
       ♦ Multi-physics

       ♦ Electronic Packaging





Multi-physics Analysis

A multi-physics analysis takes into account the interaction (coupling) between various fields, or disciplines, of engineering.  One of the more common coupled analysis is a thermal-stress analysis.  The application of a change in temperature creates a load due to the thermal expansion and stressing the structure.  A fluid-structural interaction (FSI) can be illustrated by the example of an aircraft wing.  The differential pressure created from the fluid flow causes stresses on the structure.  This interaction can be highly coupled under certain conditions if the dependency on the response is closely related.  An example of a thermal-electric coupled analysis are insulated coiled heaters that are encased in a metallic sheath.  By applying the necessary electrical properties, the heat transfer propagation can be determined for transient events.  Induction heating can be simulated using a magnetic-thermal analysis to couple the fields.  A piezoelectric field can be simulated for work with ultrasonic transducers and MEMS devices.