Mechanical Engineering Analysis
Structural Analysis
Stress analysis using linear or nonlinear techniques to verify
structural integrity can be used to assess monotonic or
cyclical loads for fatigue life and help you realize mission success on your product or
evaluate various manufacturing processes.
Fracture Mechanics
Classical fracture mechanics to evaluate material discontinuities
can be used to evaluate material geometric flaws and crack growth.
In addition to LEFM, EPFM, and failure assessment diagrams, we can provide detailed finite element
analysis to determine stress intensity factors, J-integral
values, and crack propagation.
Dynamics
Implicit dynamic techniques to solve linear dynamic problems such as
modal analysis, random, harmonic, and shock response can be used to
determine forced structural response. Explicit dynamics can be
used to evaluate extremely dynamic load conditions such as metal
forming, gun launched projectiles, and impact problems.
Thermal Analysis
Our thermal analyses can incorporate conduction, convection, and
radiation for either steady-state or transient response.
This can provide predictive results used to evaluate the heat
dissipation of critical components. The thermal management of electronic packaging is another specialty
analysis we can provide (see below).
Multiphysics Analysis
A coupled field analysis of the various engineering disciplines can
be used to account for their interaction for a variety of fields
including: structural, thermal, fluid, magnetic, electric, and
piezoelectric.
Electronic Packaging
The simulations of thermal and dynamic response of electronic
components can be used to assess damage and predict durability to
ensure that a design meets its function performance when exposed to a
variety of environments.
