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                ANALYSIS

       ♦ Structural
       ♦ Fracture
       ♦ Dynamics
       ♦ Thermal
       ♦ Multi-physics
       ♦ Electronic Packaging




Thermal Analysis

Thermal analysis to assess heat transfer between sources can involve conduction, convection, and radiation modes of transfer.  Material properties and film coefficients can be defined as functions of temperature to provide a high degree of modeling fidelity for the simulation.  Steady-state or transient thermal simulations can be used to provide results appropriate to the project needs.  In addition, we have experience with correlation to test data for transient thermal response.  This can provide additional guidance on design changes to ensure that product is robust enough to account for tolerances or alternative materials to reduce cost.